Iranian Journal of Mechanical Engineering Transactions of the ISME

Iranian Journal of Mechanical Engineering Transactions of the ISME

Fracture Behavior of Bonded Dissimilar Piezoelectric Rectangular Planes with Multiple Interfacial Cracks under Anti-plane Mechanical and In-plane Electric Impact Loads

Document Type : Research Paper

Authors
Mojtaba Ayatollahi 1
Reza Teymoori Faal 1
Mohsen Shirnezhad 2
1 Professor, Faculty of Engineering, University of Zanjan, Zanjan, Iran
2 M.Sc. Student, Faculty of Engineering, University of Zanjan, Zanjan, Iran
10.30506/jmee.2024.2036583.1350
Abstract
The paper aims to investigate the problem of interfacial cracks in two bonded dissimilar piezoelectric rectangular planes. First, we solve the problem of dynamic electro-elastic dislocation in a piezoelectric two-layer rectangle and conduct an asymptotic analysis of the stress and electric displacement. Then, the problem is formulated as a system of singular integral equations in the Laplace transform domain. The dislocation density functions on the crack surface are determined by solving singular integral equations numerically. The dynamic mechanical and electrical field intensity factors are calculated for various crack geometries, loading parameters, and different rectangular piezoelectric materials. The numerical results show that the material properties of bonded planes have a significant impact on the peak and steady values of the field intensity factors. Furthermore, the influence of the dimensions of the rectangular plane, as well as the sign and magnitude of the loading parameter on the field intensity factors, is discussed.
Keywords
Dissimilar rectangular piezoelectric planes
Dynamic electro-elastic dislocation
Electro-mechanical impacts
Interfacial cracks
Field intensity factor

Subjects

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